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WEE Diode Production Process Flow

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WEE Surface Mount (SMD) Diodes Production Process Flow 

Solder Paste--->Dice --->Soldering--->IPA  Cleaning--->Epoxy 
AssembledMolding
   IPQC IPQC  IPQC         ↓
TMTT Testing<---Lead Tin <----Trim Form<---De-flash<---After 
PlatingCuring
          ↓OQC  OQC      
Labeling--->Apperance---> --->Outgoing  
PackingCheckingStock Inspection

WEE Through Hole (DIP) Diodes Production Process Flow   

Wire--->Solder--->Dice--->Solder
ArrangedAssembledAssembledAssembled
  IPQC IPQC     ↓
The   Gluing<---Pickling<---Conversion<---Soldering
  ↓IPQC   IPQC 
SKY-GPP--->Epoxy--->Epoxy--->Lead Tin
MoldingCuringPlating
   IPQC IPQC   ↓
Outgoing  <---Stock<---Labeling<---Apperance
InspectionPackingChecking

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