WEE Technology Co.,Ltd. » Transistors WEET » WEET NPN Silicon Epitaxial Planar Transistors SOT-23 BC848A BC848B BC848C BC849A BC849B BC849C

WEET NPN Silicon Epitaxial Planar Transistors SOT-23 BC848A BC848B BC848C BC849A BC849B BC849C

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WEET NPN Silicon Epitaxial Planar Transistors SOT-23 BC848A BC848B BC848C BC849A BC849B BC849C
Spec.: https://weetcl.com/pdf/WEET_Transistors_SOT-23_BC846_THRU_BC850.pdf
Transistors Package Type:       
TO-3               TO-3 is a transistor outline (TO) package.        
TO-8               TO-8 is a transistor outline (TO) package.       
TO-39             TO-39 is a transistor outline (TO) package.       
TO-92             TO-92 is a single in-line, transistor outline (TO) package that is often used for low power devices. One of the oldest power packages, TO-92 is suitable for applications in office and communication equipment.        
TO-202           TO-202 is a transistor outline (TO) package.        
TO-220           TO-220 is a transistor outline (TO) package that is suitable for high-power, medium-current, and fast-switching power devices. TO-220 is used in home appliances, office and industrial equipment, and personal and consumer electronics. A package variant, TO-220 Full Pack, includes a fully encapsulated heat sink that does not require extra hardware for electrical isolation. TO-220 Full Pack has the same footprint as TO-220, provides electrical isolation up to 5 KV, and is often used in motor drive applications and power supplies.       
TO-223          TO-223 is a transistor outline (TO) package.        
TO-237          TO-237 is a transistor outline (TO) package.        
TO-247          TO-247 is a large, throughhole, transistor outline (TO) package. TO-247 provides excellent power dissipation and is ideal for metal oxide semiconductor field effect transistors (MOSFETs), high power bipolar transistors, and insulated gate bipolar transistors (IGBTs).       
TO-263          TO-263 is the surface-mount version of the TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3, 5, 6, or 7 leads. TO-263 can accommodate large dice because of its large pad design. It is suitable for high-power applications due to its low resistance. Typical applications for TO-263 include home appliances and personal computers.      
SO-8               SO-8 is a small outline (SO) package.        
SOT3               SOT3 is a small outline transistor (SOT) package with three leads.        
SOT23             SOT23 is a rectangular, surface-mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.        
SOT25              SOT25 is a surface-mounted, small outline transistor (SOT) package with three leads.         
SOT26              SOT26 is a plastic, surface-mounted, small outline transistor (SOT) package with three leads.        
SOT82              SOT82 is a rectangular, surface-mounted, small outline transistor (SOT) package with three leads. SOT82 is larger than DPAK and smaller than TO-220, but still comparable to TO-220 in performance. SOT82 lead frames are available in full nickel or selective silver plating and allow wire bonding with gold or aluminum wire. Often, SOT82 is used in over-voltage protection devices in telecommunications equipment. SOT82 is also used to package high-power rectifiers, DC to AC converters (DACs) and frequency converters.        
SOT89               SOT89 is a plastic, surface-mounted, small outline transistor (SOT) package with three leads and a collector pad for good heat transfer. Unlike other packages, SOT89 lead posts are up-set and not down-set. SOT89 is designed for medium power and high-speed switching applications. It is also used in applications that feature very low RDS (on), no secondary breakdown, and direct interface to complementary metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL).       
SOT123              SOT123 is a flanged, ceramic, surface-mounted, small outline transistor (SOT) package with two mounting holes and four leads.        
SOT143              SOT143 is a plastic, surface-mounted, small outline transistor (SOT) package with four leads.       
SOT223              SOT223 is a plastic, surface-mounted, small outline transistor (SOT) package with four leads and a heat sink. During soldering, the formed leads absorb thermal stress and eliminate the possibility of damage to the die. The encapsulation material enhances device reliability, allowing SOT223 to provide excellent performance in environments with high temperatures and humidity levels. SOT223 provides power dissipation of 1-1.5 W.       
SOT323              SOT323 is a plastic, surface-mounted, small outline transistor (SOT) package with three leads.       
TO-251 / TO-252 TO-251 and TO-252 are low-to-medium-power packages that feature a transistor outline (TO). TO-251 uses throughhole technology (THT). TO-252 uses surface-mount technology (SMT). Both packages provide several lead frame choices and are commonly used in home appliances, personal computers, lighting, and automotive systems.           
FPAK                  Flat package (FPAK).       
Other                 Other unlisted or proprietary packages.  
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Written by WEE Technology Company Limited

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