WEE Diode Production Process Flow
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WEE Surface Mount (SMD) Diodes Production Process Flow
| Solder Paste | ---> | Dice | ---> | Soldering | ---> | IPA Cleaning | ---> | Epoxy |
| Assembled | Molding | |||||||
| IPQC | IPQC | IPQC | ↓ | |||||
| TMTT Testing | <--- | Lead Tin | <---- | Trim Form | <--- | De-flash | <--- | After |
| Plating | Curing | |||||||
| ↓ | OQC | OQC | ||||||
| Labeling | ---> | Apperance | ---> | ---> | Outgoing | |||
| Packing | Checking | Stock | Inspection |
WEE Through Hole (DIP) Diodes Production Process Flow
| Wire | ---> | Solder | ---> | Dice | ---> | Solder |
| Arranged | Assembled | Assembled | Assembled | |||
| IPQC | IPQC | ↓ | ||||
| The Gluing | <--- | Pickling | <--- | Conversion | <--- | Soldering |
| ↓ | IPQC | IPQC | ||||
| SKY-GPP | ---> | Epoxy | ---> | Epoxy | ---> | Lead Tin |
| Molding | Curing | Plating | ||||
| IPQC | IPQC | ↓ | ||||
| Outgoing | <--- | Stock | <--- | Labeling | <--- | Apperance |
| Inspection | Packing | Checking |
Written by WEE Technology Company Limited