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WEET NPN Silicon Epitaxial Planar Transistors SOT-23 BC848A BC848B BC848C BC849A BC849B BC849C
Spec.: https://weetcl.com/pdf/WEET_Transistors_SOT-23_BC846_THRU_BC850.pdf
Transistors Package Type:
TO-3 TO-3 is a transistor outline (TO) package.
TO-8 TO-8 is a transistor outline (TO) package.
TO-39 TO-39 is a transistor outline (TO) package.
TO-92
TO-92 is a single in-line, transistor outline (TO) package
that is often used for low power devices. One of the oldest power
packages, TO-92 is suitable for applications in office and communication
equipment.
TO-202 TO-202 is a transistor outline (TO) package.
TO-220
TO-220 is a transistor outline (TO) package that is suitable
for high-power, medium-current, and fast-switching power devices. TO-220
is used in home appliances, office and industrial equipment, and
personal and consumer electronics. A package variant, TO-220 Full Pack,
includes a fully encapsulated heat sink that does not require extra
hardware for electrical isolation. TO-220 Full Pack has the same
footprint as TO-220, provides electrical isolation up to 5 KV, and is
often used in motor drive applications and power supplies.
TO-223 TO-223 is a transistor outline (TO) package.
TO-237 TO-237 is a transistor outline (TO) package.
TO-247
TO-247 is a large, throughhole, transistor outline (TO)
package. TO-247 provides excellent power dissipation and is ideal for
metal oxide semiconductor field effect transistors (MOSFETs), high power
bipolar transistors, and insulated gate bipolar transistors (IGBTs).
TO-263 TO-263 is the surface-mount version of the
TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3,
5, 6, or 7 leads. TO-263 can accommodate large dice because of its large
pad design. It is suitable for high-power applications due to its low
resistance. Typical applications for TO-263 include home appliances and
personal computers.
SO-8 SO-8 is a small outline (SO) package.
SOT3 SOT3 is a small outline transistor (SOT) package with three leads.
SOT23
SOT23 is a rectangular, surface-mounted, small outline
transistor (SOT) package with three or more gull wing leads. SOT23
features a very small footprint and is optimized for the highest
possible current. Because of its low cost and low profile, SOT23 is used
in home appliances, office and industrial equipment, personal
computers, printers, and communication equipment.
SOT25 SOT25 is a surface-mounted, small outline transistor (SOT) package with three leads.
SOT26 SOT26 is a plastic, surface-mounted, small outline transistor (SOT) package with three leads.
SOT82
SOT82 is a rectangular, surface-mounted, small outline
transistor (SOT) package with three leads. SOT82 is larger than DPAK and
smaller than TO-220, but still comparable to TO-220 in performance.
SOT82 lead frames are available in full nickel or selective silver
plating and allow wire bonding with gold or aluminum wire. Often, SOT82
is used in over-voltage protection devices in telecommunications
equipment. SOT82 is also used to package high-power rectifiers, DC to AC
converters (DACs) and frequency converters.
SOT89
SOT89 is a plastic, surface-mounted, small outline transistor (SOT)
package with three leads and a collector pad for good heat transfer.
Unlike other packages, SOT89 lead posts are up-set and not down-set.
SOT89 is designed for medium power and high-speed switching
applications. It is also used in applications that feature very low RDS
(on), no secondary breakdown, and direct interface to complementary
metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL).
SOT123 SOT123 is a flanged, ceramic,
surface-mounted, small outline transistor (SOT) package with two
mounting holes and four leads.
SOT143 SOT143 is a plastic, surface-mounted, small outline transistor (SOT) package with four leads.
SOT223
SOT223 is a plastic, surface-mounted, small outline
transistor (SOT) package with four leads and a heat sink. During
soldering, the formed leads absorb thermal stress and eliminate the
possibility of damage to the die. The encapsulation material enhances
device reliability, allowing SOT223 to provide excellent performance in
environments with high temperatures and humidity levels. SOT223 provides
power dissipation of 1-1.5 W.
SOT323 SOT323 is a plastic, surface-mounted, small outline transistor (SOT) package with three leads.
TO-251
/ TO-252 TO-251 and TO-252 are low-to-medium-power packages that
feature a transistor outline (TO). TO-251 uses throughhole technology
(THT). TO-252 uses surface-mount technology (SMT). Both packages provide
several lead frame choices and are commonly used in home appliances,
personal computers, lighting, and automotive systems.
FPAK Flat package (FPAK).
Other Other unlisted or proprietary packages.
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Written by WEE Technology Company Limited
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